Lightweight Heat Sink for Small-Size Electronic Components

1. Efficient Heat Dissipation

Made of high thermal-conductivity materials (aluminum: ≥200 W/m·K; copper: ≥400 W/m·K), they quickly transfer heat from components (e.g., CPUs, IGBTs). Optimized structures (fins, microchannels) boost heat exchange, while passive models handle 30–65W loads and active (fan-equipped) ones support ≥100W with low thermal resistance (down to 0.3 K/W).

2. High Reliability & Long Life

Passive heat sinks have no moving parts, avoiding wear and needing little maintenance (service life ≥10 years). Active models use durable PWM fans (MTBF ≥50,000 hours) and tolerate extreme conditions (-40°C to +125°C, vibration, dust) without performance drops.

3. Low Noise

Passive designs produce 0 dB noise, ideal for quiet spaces (e.g., bedrooms). Active ones adjust fan speed via PWM: 30–40 dBA at low loads (web browsing) and only ramp up when needed.

4. Cost-Effectiveness

Aluminum heat sinks use low-cost extrusion; copper-aluminum composites cut material costs. No coolant refills or frequent part replacements reduce long-term TCO (30–50% lower than liquid cooling over 5 years).

5. Flexible Installation

Available in sizes from 50×50×15mm (IoT modules) to 300×200×80mm (industrial units). Compatible with screws, adhesive, or standard sockets (e.g., Intel LGA1700), fitting diverse device designs.

6. Eco-Friendliness

Aluminum (95% recyclable) and copper (100% recyclable) reduce waste; many use 5–10% post-consumer recycled material. Meets RoHS/REACH standards, with low CO₂ emissions during production.

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Simplified Applications of Heat Sink Devices

Heat sinks are widely used in consumer electronics, industrial control, automotive, new energy, telecoms, and medical fields to cool heat-generating components/equipment—preventing overheating-related performance issues or damage. Below are their key, simplified applications, tailored to different scenario needs:

1. Consumer Electronics

Needs: Small size, low noise, and fit for compact spaces (handles 30–150W heat loads).

● PCs & Laptops: Passive aluminum heat sinks cool low-power CPUs (35–65W, e.g., Intel Core, AMD Ryzen). Active heat sinks (with PWM fans) work for high-performance GPUs (100–150W, e.g., NVIDIA GeForce) to keep gaming stable. Laptops use ultra-slim heat sinks (≤15mm thick) with micro-fins/heat pipes to avoid bulk.

● Gaming Consoles & Smart Devices: Consoles (e.g., PS5, Xbox Series X) use large aluminum heat sinks + centrifugal fans for 150–200W APUs. Phones/tablets use tiny copper heat sinks or graphite sheets to cool high-power SoCs (e.g., Snapdragon 8 Gen 4) during 5G use or gaming.

2. Industrial Control

Needs: Tolerate harsh conditions (wide temps: -40°C to +85°C, vibration, dust) and long reliability.

● Industrial Controllers (PLCs/DCS): Passive aluminum-copper heat sinks cool power modules (e.g., IGBTs) and microchips—no moving parts reduce maintenance, and corrosion-resistant coatings handle dusty environments.

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